Hot Air Soldering Station With Adjustable Hot Air Bracket BGA Rework Station

YIHUA 853AAA  Hot Air Soldering Station With Adjustable Hot Air Bracket BGA Rework Station is suitable for de-soldering and soldering BGA, SOIC, CHIP, QFP, PLCC package SMD IC, Particularly suitable for de-soldering BGA module, computer motherboard north and south bridge, all kinds of mobile phone motherboard SMT IC and LED lights. and Shrinking, Paint drying, adhesive removal, thawing, warming, Plastic welding etc.

Specification

1. Voltage -AC220C±5%
2. Max power consumption :1200W
3. Preheating station parts
4. Temperature Range 50~ 300  °c or 50~400  °c /152~572 °F or 152~752 °F
5. Temperature Stability ±2  °c
6. Display Type LED
7. Area 120*120mm

Hot Air Reworks parts

• Airflow type brushless fan spiral out wind
• Air Flow ≤130L/min
• Temperature Range 100  °c -480  °c /212°F ~896 °F
• Temperature Stability 100  °c -480  °c /212 °F ~896 °F
• Display Type LED
• Handle cable length ≥100cm
• QTY 4PCS/Outer carton
• Inner box size 37*35*18cm
• Outer carton box size 73*40*39cm
• Goods weight 5.33kg/pcs